NEPCON workshop series gathers experts from around the world under one roof. Everything you need to know about Electronic Packaging/Assembly and be up to date with the changing technology presented in this NEPCON workshop series. The workshops feature innovative solutions for our Malaysian Electronics Industry and identifies drivers to our competitive advantage
Its great to be returning again this year, the event is very well attended and some great students and questions each year hope to see you there. For further information and see all the other speakers Click Here
The Bob Willis Workshops this year feature:
Rework and Repair – Process Optimisation, Failure Modes & Tricks of the Trade
Ball Grid Array, Bottom Mounted Component Design, Assembly, Inspection & Defect Elimination
Reflow – Understanding the Complete Process & Defect Prevention
