National Physical Laboratory, NPL, has created an interactive assembly and soldering defect database, each month readers can add other defect solution to their own collection. Also available from the database…
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Our latest Process Defect Photo Guide entitled “Guide to QFN/LGA & BTC Process Defects” will be released on 16th October. This optical and x-ray guide covers the most common components,…
Its great to be invited to Paris and help organise the First Annual IPC/WHMA European Wire Harness Manufacturing Conference on 3-4th October. Further details on the conference and speakers are…
If you are using PowerPoint for training or sales presentations and need to illustrate the conventional and surface mount assembly process stages but don’t have the time to create it…
National Physical Laboratory, NPL, has created an interactive assembly and soldering defect database, each month readers can add other defect solution to their own collection. Also available from the database…
QFN/LGA/BMC Failures – Causes and Cures – Webinar New components like QFN/LGA/BTC often provided challenges to design, process and quality engineers. Solder joint failure, voiding plus contamination & corrosion are…
Solderability Benchmarking, Failures & Testing Methods 14th August All our webinars are based on UK time you can check the time in your location Click Here Benchmarking you PCB surface…
All our webinars are based on UK time you can check the time in your location Click Here 8th May 2.30pm on line webinar, to book your place or find…
We review recently released reference books for electronics manufacturing that can help make an engineer’s life easier and add to your in-house library. We are always interested for publishers to contact…
Our next SMART Group Defect Guide is entitled “Printed Circuit Surface Finish Defect Guide” and will be released on Wednesday 29th March. This relates to different surface coating on PCB…
