Coming soon a new webinar and workshop on process and product failures due to dendrite formation on the surface of electronic assemblies. A simple and complete explanation of the subject with lots of demonstration videos showing dendrite formation on different surfaces. Each delegate will receive a copy of a special dendrite failure video to show in their company for reference and future training with a copy of the slides presented
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Dendrite Failure – Causes & Cures
Dendrite failure on printed circuit board assemblies is quite common but often not investigated fully to pin point the root cause. This is due to the intermittent nature of the failure or just replacing components seems to solve the problem. Dendrites are a metallic growth between conductive surfaces which form an intermittent connection causing difficulty in product operation or dramatic failure
Increased dendrite formation is due to:
Decreasing component pitch
Increasing use of poorly implemented coatings
Voltage difference between conductors
Poor consideration of operating environments
Lack of material and product testing
PCB and component cleanliness
Elevated operating temperatures
Increased condensation levels
Dendrites can be copper, silver or other metals forming a fern like structure across insulated surfaces. Depending on situation and the level of moisture a conductive path can form over components, around solder mask and under conformal coatings
Topics covered:
What is a dendrite?
Where do they form?
What causes dendrite formation?
Common causes and locations of failure
Does cleaning or conformal coating help?
Can you test materials and product reliability?
Presented by Bob Willis
Most of our webinars will run for between 60-90min with question and answer session. If you have a specific issue you would like discussed, they should be provided before the start of the webinar. The webinars are limited to 100 delegates/companies. A copy of each of the slides are provided after the webinar
