Hand soldering and de-soldering with lead-free solders does requires higher process temperatures. This material change can impact on the printed circuit board and components used. It can also impact on…
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Producing a microsection is a very valuable and cost effective way of assessing PCB defects, component failures or solder joint quality. Understanding the steps in producing a section can be…
Solder balls and solder beading have been a process issue for many years and they may not cause product failure or quality problems but they are not desirable. Solder balls…
Defect of the Month is a series of video produced for and featured as part of the NPL/IPC video library with examples taken from the NPL Defect Database http://defectsdatabase.npl.co.uk/ Over…
Bob Willis reviews recently released reference books for electronics manufacturing that can help make an engineer’s life easier and add to your in-house library. All our book reviews and Top…
Having process problems, we solve process problems on a daily basis So what are solder spots? They are often a problem in modern reflow assembly, in fact in any process…
The following webinars are available free online throughout 2017 and are organised by Bob Willis for NPL. A direct link is provided for each event to allow you to book…
Twenty engineers from China visited Chelmsford this week to attend four seminars presented by Bob Willis. The seminars were held at the Anglia Ruskin University and organised by the Open…
MACFEST is a collaborative research project involving partners A-Gas Electronic Materials, C-Tech Innovation, MTG Research, the Institute of Circuit Technology, the University of Leicester and Merlin Circuit Technology. Partly funded…
Thursday 1st December at 2.30pm UK Time Presented by Martin Wickham NPL Electronic Interconnection Group undertakes a wide range of research and collaborative projects in support of the electronics industry….
