Three new books this month, hopefully there is something that will have you visiting the book shop or online service soon like www.smta.org Nanopackaging Nanotechnologies and Electronics Packaging Editors: James…
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The Electronics Interconnection Group’s webinars are now in their 8th year. The Group is internationally recognised for its practical and innovative work on lead-free reliability, PCB interconnection failures, tin whisker…
More focused webinars than any other online provider for the electronics industry. If you have a specific topic you would like us to present online let us know so we…
One of our recent online webinars for Vision Engineering covered the use of conductive adhesives as a solder alternative. The webinar covered assembly, design, reliability and process issues, plus what to…
While the use of blind vias has become fairly common in electronics manufacturing today, inspection of via holes during fabrication is still problematic. We take a look at a simple…
Join Bob for three workshops in Malaysia during 7-9th August organised by Knowledge Group in Penang Bob Willis will be presenting three one day workshops as part of EPCONASIA 2018…
Here are links to our latest Book Review videos featured on the Bob Willis YouTube Channel If you are writing a book related to electronics and manufacturing and would like to feature…
Here are two of the latest books to be reviewed for the industry. We have many titles we have reviewed and featured on line for IPC, SMTA and Circuits Assembly…
Over the last few years I have been asked to examine examples of Ball Grid Array (BGA) defects which are referred to as dropped ball. This type of defect can…
The subject of outgassing, as it relates to printed circuit assemblies during the wave and selective soldering operation, has been an area of debate for many years. Until recently the…
