QFN/LGA/BMC Failures – Causes and Cures – Webinar
New components like QFN/LGA/BTC often provided challenges to design, process and quality engineers. Solder joint failure, voiding plus contamination & corrosion are just a few of the problems experienced so far. Any large area component with low stand off reflow soldered to a substrate can be a challenge but with ever decreasing pitch the need for good process validation and correct design is vital
Having had many years of hands on experience with these parts conducting design reviews, setting up processes, conducting failure analysis we may not have all the answers but we do know the right questions to ask in manufacture
Provided FREE with this webinar are Bob Willis QFN Inspection & Quality Control wall charts to use in your own manufacturing and training facility
Presented by Bob Willis
Our webinar last approximately 60-90mins with the opportunity for questions at the end of the session. Questions or specific defect examples can be sent by delegates in advance for feedback during the webinar
Topics to be covered
Design options to reduce failures
Process improvements in design and assembly
Void reduction and prevention
Improvements in joint reliability
Simple 5min solderability assessment
Improved cleaning performance
No clean and cleaning results with SIR data
Process results with vapour phase, convection reflow & vacuum
IPC design and process guidelines
After the webinar there is a Q&A session which provides ample time for all delegate questions to be answered. However, if a delegate has a process example they would like covered in the webinar it will need to be provided in advance of the session
Each webinar last approximately 60-90mins with the opportunity for questions
